Fluid Dispensing Application Examples

Syringe Barrel Receiver Head – 700 Series

Aerospace Sealant Scraper and Spatulas

2-Component Mix And Dispense Systems

Fluid Dispensing Application Examples

Here at Techcon, we know that there are many different applications forfluid dispensing. We offer a large selection of systems that range from manual to high-speed automated solutions.

Adhesive dispensershave three dispensing methods: manual handheld, semi-automatic and automatic. Each is used in several different industries, including aerospace, manufacturing of medical devices and assembly of electronics. Our full adhesive dispensing system line addresses the needs of most dispensing applications, such as:

Bonding With Cyanoacrylate ApplicationCA is a very frequently used adhesive in the generic bonding application and it is required in a moisture resistant dispensing system. TheTS5622VU Diaphragm valvealong with theTS500R – Multi-Purpose Dispensing Valve ControllerandTS1258 – Pressure Tank (Pot)is a perfect system for this application.

Domed Logo Badges Application (Doming)Consumer & business products often display the manufacturers name on a sticker that is encapsulated underneath a dome of fluid. This is called Doming and is commonly used as this adds a better look and feel to the product. TheTS5622VU-DVDwith theTS500R – Multi-Purpose Dispensing Valve ControllerandTS1258 – Pressure Tank (Pot)is a perfect system for this application.

Most medical device manufacturing applications require a dispensing system that can provide a highly repeatable dispensing of UV adhesives. With the unique needle shut off design inside the dispensing tip, theTS5440 – Microshot Needle Valveis a perfect choice for these applications. TheTS500R – Multi-Purpose Dispensing Valve Controlleris recommended for this valve.

Spray Conformal Coating Application

TheTS5540 Series – Spray Valvesalong with theTS500R – Multi-Purpose Dispensing Valve Controllerand theTS1258 – Pressure Tank (Pot)is an ideal system to spray conformal coating material on the surface of an assembled printed circuit board to provide protection against moisture, dust and corrosion from extreme environments.

When a high throughput or large shot size is required for gasketing or similar Form-in-place-gasket applications, theTS941 Series – High Pressure Spool Valvealong withTS350 – Digital Fluid Dispenseris the recommended system choice. Whether the fluid is fed from a cartridge or pail pump, the TS941 Series will dispense accurately and consistently through a dispensing nozzle or dispensing tip.

For finer deposit control of sealing material, theTS5322 Series – Mini Spool Valvewith the TS350 controller is recommended.

TheTS7000 Series – Interchangeable Material Path (IMP) Rotary Valvealong with theTS500R – Multi-Purpose Dispensing Valve Controlleris an ideal dispensing system to dispense the Dam around the die of an integrated circuit (i.c.) as an alternative method to using the pre-form molded design.

Plural Component Material Dispensing

Plural component material dispensing is no longer a problem when using a Disposable Material Path valve. When the 2-component material starts to cure, just throw away the valve wetted parts. It takes less than 1 minute to replace new parts.

For low viscosity material, theTS1212 – Disposable Pinch Tube Valvealong with theTS350 – Digital Fluid Dispenseris recommended. For medium to high viscosity material with high repeatability rate requirement, theTS5000DMP – Disposable Material Path Rotary Valvewith theTS500R – Multi-Purpose Dispensing ValveControlleris suitable.

is the most difficult material to dispense. TheTS7000 Series – Interchangeable Material Path (IMP) Rotary Valveis designed specifically to dispense solder paste without clogging and separation. Dot size as small as 0.010 (0.254mm) can be dispensed consistently. A majority of automated dispensing systems incorporate theTS7000 Series Valvefor solder paste dispensing.